In the technical age of modern developed electronic industry, the humidity in the air has become the main cause for those inferior products. So, to control humidity in the air of the workshop effectively is an important way to improve productivity. Normally, in semiconductor and electronic industry, the key procedure of SMT, during the heating process, fine cracks and non-weld joint may happen on IC (ex. PBGA, BGA, TQFD) because of the humidity.
Material:1.2mm cold rolled plate of steel,4mm tempered glass Capacity:157 liters Outer size:W440*D450*H935mm Inner size:W446*D370*H877mm Application:Suitable for storing: Anti-oxygen materials, Chip, IC, Semiconductor, Precision components and instruments, Military industry, Lens, Non-ferrous metal, BGA, SMT,SMD, Module, Films, Wafers, Lab chemical and medicine etc.